Field Proven in HVM Operations and Customizable for unique and demanding applications demands

Description

Kensington’s Robot End-Effectors have a long history of operation in semiconductor wafer fabrication. Several of Kensington’s End-Effector innovations have advanced wafer processing capability. These include 300mm Edge-Grip for reduce particle performance and Through Beam Technology for wafer mapping. End-Effectors are used across the semiconductor equipment spectrum: Metrology Systems; Deposition Systems; Etch Systems; Reticle Process Systems; Thermal Processing Systems.

Configurations

• Edge Grip End-Effector
• Vacuum Grip End-Effector
• Through Beam : Vacuum Grip and Edge Grip end-effectors
• Thin Wafer Vacuum End-Effector
• High Temperature Applications
• Square Substrate Handling with Through Beam
• Transparent Substrate Handling with Through Beam
• Custom configurations for a wide range of applications, vacuum end-effectors
• Wafer sizes 50 mm to 300 mm
• Crown/Taiko Wafer Designs

End-Effectors are available for use on multiple robot types as well as for manual wafer handling applications.

Contact Kensington today for technical details and to obtain a quotation.